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Factory Thermal Conductive Gel For Electronic Components Cooling

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Factory Thermal Conductive Gel For Electronic Components Cooling

Name: Factory Thermal Conductive Gel For Electronic Components Cooling
Brand: ZIITEK
Price: 1 USD

Brand Name : ZIITEK

Model Number : TIF015-07

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 10000/day

Delivery Time : 7-15work days

Packaging Details : 1000tubes

Products Name : Factory Thermal Conductive Gel For Electronic Components Cooling

Specific Gravity : 2.5 g/cc

Good thermal conductive : 1.5 W/mK

Color : Green

Continuous Use Temperature : -45~200℃

Flame Rating : 94V0

Keywords : Thermal Conductive Gel

Material : Ceramic filled silicon material

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Factory Thermal Conductive Gel For Electronic Components Cooling

TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF015-07 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF015-07 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

TIF015-07-Specification-sheet.-pdf.pdf

Application

> Heat-sink & frame

> LED backlight module,LED lighting

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications

Feature

> Thermal conductivity: 1.5W/mK

> Soft, very low compression

> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling

TIF^TM015-07 Property
Property	Value	Test method
Color	Green	Visual
Construction & Composition	Ceramic filled silicon material	*****
Viscosity	4000 Pa.s	GB/T 10247
Specific Gravity	2.5g/cm³	ASTM D297
Thermal conductivity	1.5 W/mK	ISO 22007-2
Thermal diffusivity	0.847 mm²/s	ISO 22007-2
Specific heat capacity	2.2 MJ/m³K	ISO 22007-2
Continuous Use Temperature	-45 ~200°C	******
Flame Rating	94V0	UL E331100

Package :

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

Factory Thermal Conductive Gel For Electronic Components Cooling

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Factory Thermal Conductive Gel For Electronic Components Cooling

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product Tags:

thermally conductive putty

electrically conductive putty

China Factory Thermal Conductive Gel For Electronic Components Cooling wholesale

Factory Thermal Conductive Gel For Electronic Components Cooling Images

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