Thermal Gap Filler Silicone Free Thermal Pad
Z-Paster100-20-11F Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.
The roleis to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. lt applies to the liner based on silicone suitably.The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Z-Paster100-20-11F Series Datasheet-(E)-REV01.pdf
Features
> Silicone-free
> ROSH compliance
> Good thermal conductive: 2.0W/mK
> Soft and Compressible for low stress applications
> Available in varies thickness
Application
> Cooling components to the chassis of frame
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment
| Typical Properties of Z-Paster100-20-11F Series |
| Color | Dark gray | Visual | Dielectric Breakdown Voltage (T= 1mm above) | >5000 VAC | ASTM D149 |
| Construction | Silicone-free The metal oxide fills | ********** | Dielectric Constant | 5.5 MHz | ASTM D150 |
| Thermal Conductivity | 2.0 W/mK | ASTM D5470 | Volume Resistivity | 6.0X1013 Ohm-meter | ASTM D257 |
| Hardness | 65 Shore 00 | ASTM 2240 | Continuous Use Temp | – 20 To 125 ℃ | ********** |
| Specific Gravity | 2.65 g/cc | ASTM D297 | Outgassing (TML) | 0.30% | ASTM E595 |
| Thickness | 0.020"-0.200"(0.25mm~5.0mm) | ASTM D374 | Flame Rating | 94 V-0 | equivalent to |
Standard size
0.010-inch to 0.200-inch (0.25mm to 5.0mm)
Options
Proprietary NS1 option available to eliminate tack from one side to aid in handling.
Packaging Details & Lead time
The packaging of Silicone free thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
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Optimal Performance Dark Gray Thermal Gap Filler Silicone Free Thermal Pad With Specific Gravity 2.65g/cc Images
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